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Title: BFL: Bumping is done, chips going to packaging tomorrow Post by: ralree on March 02, 2013, 03:35:25 AM https://forums.butterflylabs.com/bfl-forum-miscellaneous/1176-february-28th-update-discussion-2.html#post16618
http://24.media.tumblr.com/tumblr_mc9ebkpEjI1rii545o1_500.gif Title: Re: BFL: Bumping is done, chips going to packaging tomorrow Post by: Beans on March 02, 2013, 03:44:25 AM You seem a little to optimistic. If the past is any indication, it will take them at least 2 months to get through the rest of the list.
Week of January 13th Travel to packaging facility for final prep and walkthrough Confirm travel plans and trip details with lead ASIC engineer for trip to fab Week of January 20th Final assembly facility prep Leave for fab at the end of the week Week of January 26th Final chips roll off the line Grab suitcase, a BMW or a Peugeot and make a break for the airport, Ronin style (You can see Tom about 6 minutes, 20 seconds into the video) Arrive California at chip packaging plant KC facility starts assembly process of units to drop PCB into Week of February 3rd Chips packaged Packaged chips sent to assembly house Assembled PCB is set for final testing and MCU programming Notify users to start sending their FPGA units or BTC for trade in participants Bulk assembled PCBs arrive in KC, we start dropping PCBs into waiting units Boxing/labeling for shipment Week of February 10th We implement the 1/3 shipping plan en mass 1/3 of our assembled units will go to new orders in FIFO 1/3 of our assembled units will go to upgrade orders 1/3 will be randomly selected from both groups We descend upon the Post Office, DHL, UPS and FedEx like a horde of angry locust Title: Re: BFL: Bumping is done, chips going to packaging tomorrow Post by: ralree on March 02, 2013, 03:45:12 AM You seem a little to optimistic. If the past is any indication, it will take them at least 2 months to get through the rest of the list. Week of January 13th Travel to packaging facility for final prep and walkthrough Confirm travel plans and trip details with lead ASIC engineer for trip to fab Week of January 20th Final assembly facility prep Leave for fab at the end of the week Week of January 26th Final chips roll off the line Grab suitcase, a BMW or a Peugeot and make a break for the airport, Ronin style (You can see Tom about 6 minutes, 20 seconds into the video) Arrive California at chip packaging plant KC facility starts assembly process of units to drop PCB into Week of February 3rd Chips packaged Packaged chips sent to assembly house Assembled PCB is set for final testing and MCU programming Notify users to start sending their FPGA units or BTC for trade in participants Bulk assembled PCBs arrive in KC, we start dropping PCBs into waiting units Boxing/labeling for shipment Week of February 10th We implement the 1/3 shipping plan en mass 1/3 of our assembled units will go to new orders in FIFO 1/3 of our assembled units will go to upgrade orders 1/3 will be randomly selected from both groups We descend upon the Post Office, DHL, UPS and FedEx like a horde of angry locust Well at least the only other game in town can't even ship anything outside of China for less than $400, so there's that. Oh and their products seem like they have some real issues (see the "my 2 avalons stopped working" thread). The hardest parts are nearly over - I can understand the R&D taking much longer than their initial estimated times, but slamming things into boxes is a little harder to screw up. Title: Re: BFL: Bumping is done, chips going to packaging tomorrow Post by: Phinnaeus Gage on March 02, 2013, 05:03:51 AM Wonder why Chicago was never mentioned in that original to-do list. It's proven now to be a vital step, yet nada a word.
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