Bitcoin Forum

Bitcoin => Hardware => Topic started by: Bitcoinorama on July 11, 2013, 09:12:58 PM



Title: Avalon July ASIC July Update, Trade-In, Batch #3, Chips and more
Post by: Bitcoinorama on July 11, 2013, 09:12:58 PM
Latest Newsletter:


Avalon ASIC July Update, Trade-In, Batch #3, Chips and more

What's an update without some photos?

https://i.imgur.com/uBk7Q9N.jpg

Batch three Refund

Understandably, batch three has been overdue for a few weeks, whilst shipping is due to start Monday, and finish within 2 weeks. Those who do not wish to wait can fill out the form for a refund, please note the deadline for these refunds is before the 14th, once we start shipping we will not be honoring any refunds that gets posted.


Finally caught up

Scaling up production has been problematic for us in the past, but today? No more. The speed which we finished shipping batch #2 which took about 3 weeks (aside from custom issues with Serbia and Germany), batch #3 will be no different, and will be even faster. We modified the module upgrade design so it'll fit both generation 1 and generation 2 case setups, the chips are being moved to shanghai so they may begin to deliver by mid-july, trade-in list has been acquired and cleaned up. ( I hope everyone already have an account on the store. ) The Avalon team are very excited to get these things over with so we may get back to engineering.


In Summary

Trade-in emails are going out at the same time as this newsletter.

The chips is scheduled to start delivering mid-july in order which they were purchased.

Batch three starts shipping mid-july, expected to finish within 2 weeks as there is no order issues unlike batch #2

Part of batch #3 will have different design as we continue to improve our unit.

Once batch three starts shipping and no problem arises, we will begin taking orders for upgrade modules.
upgrade modules will be in-stock as there is no pre-order, delivery time frame 3-5 days.

Next generation chip is in the works, 55nm will not be very different physically for backward compatibility.

We will make announcement at least 2 month prior of 55nm release so those who purchase our generation one chip will not be in the dark.

--
Doesn't mention anything about the BTCman/Gridman/BTCgarden smacktalk or his potential 55nm chips ambition...


Title: Re: Avalon July ASIC July Update, Trade-In, Batch #3, Chips and more
Post by: dani on July 11, 2013, 09:59:41 PM
where did you get that photo from?


Title: Re: Avalon July ASIC July Update, Trade-In, Batch #3, Chips and more
Post by: koob on July 11, 2013, 10:21:07 PM
where did you get that photo from?

It is in newsletter


Title: Re: Avalon July ASIC July Update, Trade-In, Batch #3, Chips and more
Post by: kendog77 on July 11, 2013, 10:27:23 PM
Nice, I can't wait until the chips start shipping in bulk so the ASIC mining hardware shortage will end, and sellers will have no choice but to lower their prices and stop gouging.


Title: Re: Avalon July ASIC July Update, Trade-In, Batch #3, Chips and more
Post by: allinvain on July 12, 2013, 01:36:32 AM
Oh boy, get ready for a MASSIVE increase in difficulty. FPGA and GPU miners will be surely forced to shutdown now.


Title: Re: Avalon July ASIC July Update, Trade-In, Batch #3, Chips and more
Post by: Wayne_Chang on July 12, 2013, 05:20:32 AM
If they can improved the thermal design to make the fan noise to a acceptable level, it will be perfect for me.


Title: Re: Avalon July ASIC July Update, Trade-In, Batch #3, Chips and more
Post by: dimka890 on July 14, 2013, 07:40:18 AM
Interestingly what will be the cost of the new 55nm chips?


Title: Re: Avalon July ASIC July Update, Trade-In, Batch #3, Chips and more
Post by: yocko06 on July 14, 2013, 08:50:13 AM
can't wait to get my 85ghs miners!


Title: Re: Avalon July ASIC July Update, Trade-In, Batch #3, Chips and more
Post by: monkee on July 14, 2013, 09:04:48 PM
sick looking redesign.  i like the slots :)  

we can see the module or heatsink is different as batch 2 did not have power and IDE like connections on the top like that.

also the heatsinks face each other so a tunnel of air will blow between them.  cool idea.

however, i also noticed that the modules look much closer together and also closer to the case edges.  this leaves 2 options i can think of...

smaller footprint unit?  it might mess up stacking though

longer modules?  hmm, better option. or maybe longer heatsinks

the tightly cropped picture adds to my suspicion

are my eyes playing tricks??