DATELINE 12/10/2013: AUSTIN, TX.
As we move closer to manufacturing our first run of TerraMiner™ units we will be providing status reports for our customers who are interested in the technology aspects of what goes into making a Bitcoin miner.
Today we can announce that we have now entered the final phase of the fabrication process and we have received target dates from our partners regarding finalization of key components in the GoldStrike™ I ASIC chip:
1. FABOUT
The fabout of the first wafers for the GoldStrike™ I is scheduled to occur on December 17th
The wafer etching process in which the blank wafers are etched with the chip layout at the foundry is complete and the chip leaves the foundry for bumping.
2. BUMPOUT
Following the fabout, we have a projected bumpout date of December 21st
The bump process attaches solder balls to the wafer, which is then flipped over and attached to the substrate during packaging.
Hand-in-hand with the fabout and bumpout, manufacturing of the PCB’s, cases and other key components has commenced. CoolIT Systems specialized liquid cooling units and Power-One’s platinum-certified power supplies are being stockpiled, ensuring that once the final GoldStrike™ I ASICs arrive our entire supply chain will be ready to begin the first TerraMiner production run.
As you can see in the pictures below we have finished design and prototyping of the board and case design and stand ready for the arrival of the GoldStrike™ I chip.
To find out more about the mysterious world of fabout and bumpout, and to get a peek at the insides of a TerraMiner, head over to our first blog post by Jim O’Connor, CoinTerra’s VP of Hardware Engineering. Expect further exciting updates as we head towards the finish line.
Source:
http://cointerra.com/engineering-update-projected-goldstrike-fabout-bumpout-dates-announced/
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In other words, there will be no December deliveries and January is iffy, just like I told you all.
