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Author Topic: New BFL update. 25 February 2013.  (Read 12547 times)
PuertoLibre
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May 12, 2013, 09:13:15 AM
 #121

Hmmm doesn't seem like they made this date either... are there a lot of these posts where they miss a deadline?
More times than you have toes AND fingers.
tom_o
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May 12, 2013, 09:36:38 AM
 #122

Hmmm doesn't seem like they made this date either... are there a lot of these posts where they miss a deadline?

The 'deadlines' have generally been 2 weeks or two months, since June last year, and today they are still 2 months...
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May 12, 2013, 09:53:08 AM
 #123

Josh wrote thuesday they fab gets the chips or the old fab makes few chip or where ever ... I dobt kbow more whats going onn  Sad
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May 12, 2013, 10:46:31 AM
 #124

10 May 2013 Update


Another busy week here at the labs. We continued to refine the LS/S/MR boards while waiting for our next delivery of chips. We expected them today, Friday the 10th, but the packager has been dragging their feet in the process (and one of the reasons we initiated the switch to a new packaging facility, as mentioned previously). The first bulk shipment from the new packaging house is expected on Tuesday and should consist of several hundred chips, which we will be building into all the product lines, assuming no snags are encountered this weekend on the latest rev of the LS/S/MR boards. If there is a blocking problem, we will build them all into 5 GH/s units, but we don't expect any blocking issues at this point.

The rest of the wafers are expected at the bumping facility the following week, and once bumped, they will head to the new packaging facility which is capable of a much higher volume, so we expect them to be packaged pretty quickly and ready for use after they arrive at the facility.



we will see Tuesday .
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May 12, 2013, 11:02:06 AM
 #125

10 May 2013 Update


The rest of the wafers are expected at the bumping facility the following week, and once bumped, they will head to the new packaging facility which is capable of a much higher volume, so we expect them to be packaged pretty quickly and ready for use after they arrive at the facility.



we will see Tuesday .


And how long were talked about the other wafer ?
Timeframe after them and builk and ship ?
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May 12, 2013, 11:03:04 AM
 #126

10 May 2013 Update


Another busy week here at the labs. We continued to refine the LS/S/MR boards while waiting for our next delivery of chips. We expected them today, Friday the 10th, but the packager has been dragging their feet in the process (and one of the reasons we initiated the switch to a new packaging facility, as mentioned previously). The first bulk shipment from the new packaging house is expected on Tuesday and should consist of several hundred chips, which we will be building into all the product lines, assuming no snags are encountered this weekend on the latest rev of the LS/S/MR boards. If there is a blocking problem, we will build them all into 5 GH/s units, but we don't expect any blocking issues at this point.

The rest of the wafers are expected at the bumping facility the following week, and once bumped, they will head to the new packaging facility which is capable of a much higher volume, so we expect them to be packaged pretty quickly and ready for use after they arrive at the facility.



we will see Tuesday .


lol he didnt say which tuesday  Tongue

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May 12, 2013, 11:13:30 AM
Last edit: May 12, 2013, 11:23:38 AM by Red_Evil
 #127

He did it look bfl forum...
But that will the second batch or ? The first batch arrieved friday
 https://forums.butterflylabs.com/announcements/692-bfl-asic-status-3.html#post31814
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