10 May 2013 Update
Another busy week here at the labs. We continued to refine the LS/S/MR boards while waiting for our next delivery of chips. We expected them today, Friday the 10th, but the packager has been dragging their feet in the process (and one of the reasons we initiated the switch to a new packaging facility, as mentioned previously). The first bulk shipment from the new packaging house is expected on Tuesday and should consist of several hundred chips, which we will be building into all the product lines, assuming no snags are encountered this weekend on the latest rev of the LS/S/MR boards. If there is a blocking problem, we will build them all into 5 GH/s units, but we don't expect any blocking issues at this point.
The rest of the wafers are expected at the bumping facility the following week, and once bumped, they will head to the new packaging facility which is capable of a much higher volume, so we expect them to be packaged pretty quickly and ready for use after they arrive at the facility.
we will see Tuesday .