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LOL at the desperation in this thread, people going to be sad when KNC runs away.
It was a larger model than I thought as I just skimmed over the pic, but just try running that at 320W 24/7 LOL.
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Wait wait wait wait wait... that's they're Jupiter cooling? ROFLMAO. Those heatsinks are rated for peak of ~140W, not 250. And they think they can exhaust 1kw of heat with 2 standard 120mm fans?
My 1x250mm 1x200mm, 5x140mm and 2x120mm case was struggling with 800-900W. I told you those thermal simulations were really, really wrong.
Sorry to disappoint you guys, KNC lives in the clouds.
Don't you get tired of pretending to be smarter than just about everyone else? I can see it now, the big failure... clearly, KNC should've entrusted you with the design, as the OrSOC engineers obviously know nothing about chip design/thermals  . I've worked with 100s of desktop based heatsinks, but whatever go ahead. They still never explained their simulations that were FAILED. Enjoy your vapourware/house fire. |
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Exactly. The "prettiness" of the case has to be about the stupidest complaint for any industrial device. Personally I would be happy if any ASIC manufacturer just delivered boards. A board in a ghetto rack hashing today is worth a LOT more than a board is some pretty backordered case which will ship in "two weeks".
Case design is about longevity. As a broker I'd prefer for my clients hardware to survive being shipped round the globe. Some of my Avalons have taken more flights in 6 months than I have in my entire life. |
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Wait wait wait wait wait... that's they're Jupiter cooling? ROFLMAO. Those heatsinks are rated for peak of ~140W, not 250. And they think they can exhaust 1kw of heat with 2 standard 120mm fans?
My 1x250mm 1x200mm, 5x140mm and 2x120mm case was struggling with 800-900W. I told you those thermal simulations were really, really wrong.
Sorry to disappoint you guys, KNC lives in the clouds.
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5V HAHAHAHAHA enjoy that.
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difficulty increase of 35% every 10 days from this point on Stopped reading there. Everything else is just bullshit. |
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Final final bump for visiblity
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That was such a tard comment. Anyway, physical incompatibility is incompatible. You can't put B3 modules in a B2 unit.
Whoa dogie, down boy. That's exactly how your title reads. It's exactly how everyone uses "incompatible" when talking about computer gear. "Incompatible" means to me that there is no way to get it to work. On top of that you say you can't put them in a B2 unit, but you show a B2 unit with a B3 board in it? Wat? You clearly "put it in", whether or not you mounted it is another question. +1 Mixing them would confuse the software temperature targets of the different modules too since B3 modules read 20 degrees higher due to being closer to the chip.
Would this matter? It's possible that B3 bitstream is optimized for B3 temps (Atleast for the open sourced hardware solution). Though wouldn't that just make the fans run faster for that 'sensor'? From my understanding the temp sensors are aligned 1:1 with regards to the fans. If a higher temp is read in the lower module the higher temp would make that fan go faster? Therefore, possibly making the issue a non issue? Just guessing and haven't checked. This assumes the same temp sensors are being used (and based on pictures it appears the same ones are used). 1) You can only have 1 B3 module fit inside 2) It must be rotated 3) It can not be screwed in 4) It is vulnerable to being shorted 5) It receives reduced cooling 6) Case must be on its 'back' 7) Case can not be moved It is a temporary solution to my 'pure' B3 arrives and it can live in there. |
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Mixing them would confuse the software temperature targets of the different modules too since B3 modules read 20 degrees higher due to being closer to the chip.
Yep. In my case there are no probes on the 4th module so its scaling off the others. |
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When you will get ROI, buy a camera please.
My main phone is being replaced, this is an old N1 with a crazy ROM that breaks camera. |
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That was such a tard comment. Anyway, physical incompatibility is incompatible. You can't put B3 modules in a B2 unit.
Yet, you just did! (Thanks for sharing though.) The module is lose in the case and can't be moved. Cooling is compromised, and its at risk of getting shorted. You can only physically fit 1 module in as well, you could have 2/2. |
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Hmm interesting, the batch 3 (3 module) I received a few days ago has the B2 style modules.
Yes that's not a true B3 though. The unit I'm showing you IS actually a B3, but its a B2 style. There are: B1 B2 B3 (old B2) True B3. True B3 modules aren't compatible with B2/old B2. |
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Final bump for visibility
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Anyone need help setting these up just pm  |
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Got an upgrade? What is she wearing now, a unicorn?
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Sounds like a drill press applied to the bottom panel could solve this.
Do the new modules use more, longer, and thicker screws (I hope)?
The only slot you can put a B3 in is the bottom, and then yes you'd have to drill it. You'd also have to drill new holes with the new spacings. IIRC there is one less mounting screw, same screws but with different spacings. |
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1) Can I have a discount if I show you my boobs
2) Starting price?
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When you state "not compatible" you imply that they aren't electronically and/or physically compatible. They're just not physically compatible ...
Before connecting them electronically did you check if they are electronically compatible or did you do the "close your eyes and pray" type of deal?
That was such a tard comment. Anyway, physical incompatibility is incompatible. You can't put B3 modules in a B2 unit. |
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The boards connecting the individual cards to the cables have a new design which does not fit with original modules. See below pic. Additionally, the mounting screws and spacing are different on B3 modules. *note I've just ghetto mounted the 4th B3 module for now, its not [and cant be] screwed into the case. Rotating it is the only way to get it to fit.  Shitty camera is shitty. B2 3 module with a B3 module |
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