This is a general announcement regarding performance expectations.   Until they are produced and tested, all data is preliminary and  subject to change.  This thread will be updated as we move forward.

Technology: 28nm
Package: TBD; most likely wirebonded FBGA in ceramic or plastic w/ copper slug
Interface: SPI to on-chip SoC
Hashrate: 180-256 GHs per die
Power Usage: 0.14-0.30 W/GHs
Price Range: 0.25-0.47 $/GHs

Datasheets and reference designs will be available for residential and datacenter designs.  Certain Havelock virtual units will have the option to be exchanged be directly for hardware.  Other partnership options are available.