The fins are slightly serrated as well or ribbed and there are two raised channels for holding fans or mounting, two fins in on either side.
But that is an amazing result. What is the heat compound simulated in the model?
Also the thermal vias will be filled with an epoxy, I think???, to prevent solder wicking... also the base of the heat sink is 5mm that is pictured pretty sure.
I didn't account for serrations but I think I can apply a surface area multiplier - this will improve heat-sink performance. The two raise channels will probably have little effect on the final result. The current assumption is that there is "perfect" contact between the sink and the board. I think I can add a compound on the interface but have not done so yet.
I will adjust the thickness of the base in the next run. As far as the thermal vias, I am still working on tweaking this. I currently am using copper lands which extend from the pad of the Avalon to the heat sink. Modeling is always a trade-off, it is important to get things as close as possible but sometimes too much detail is not worth the effort. These PCB/heat models can be very accurate (90-99%) so long as the main features are present and the mesh resolution is good enough.
Vigil, are you taking orders for your heatsink when you've perfected it to your liking? If not, could you recommend the best place in the US to get them manufactured? I'm looking for 16.
As interesting as producing my own heatsinks would be, I currently have no immediate plans to sell heatsinks, but who knows how things will work out in the future. This was a rough model of a commercially available heatsink posted on another forum by Bicknellski.
Interesting what difference 10mm to 32mm makes. You have an interesting software there.
Yes, heat-transfer is a game of surface-area. This is why insulating a pipe too much can actually have the opposite effect.
