If you try another adhesive, please post your results. Many people have talked about using Arctic Silver, but I have not seen a report of it actually working. Thanks for your results on the "black stuff" that was used on S9s.
The Arctic Silver adhesive, and other thermally conductive epoxies I found specs on, are all around 10X worse at moving heat than the low temp solder. So I have my doubts about it working.
We're trying to get away from soldering the heat sinks on since there's such a risk of lose solder balls causing shorts and failures.
It took me a while to work out a good procedure for attaching the heat sinks with the solder, but now I do it routinely and rarely have issues. If I get motivated enough I'll take some photos or maybe video and create a post showing my method.
Here are the basics of what I do. I clean the solder off the heat sink by applying flux, heating with a hot air tool, and then wiping away the solder with a cotton swab. Then I add a bit of solder paste to the top of the chip along with some flux, and use a soldering iron to flow the solder evenly and remove any extra. I then clean the heatsink and the chip with isopropyl, apply a small amount of flux to the top of the chip, place the heatsink on the chip, then heat with a hot air tool until the solder flows. You can adjust the position of the heatsink for only a small amount of time after you start heating, otherwise, you risk moving the chip. I don't touch it after about 5 seconds with the heat.
The original solder paste on these boards seems to be a low temp paste that just causes the heat sinks to come lose while operating so we're trying to find a way to mitigate that.
I believe the solder they use has a 138deg C melting point, so pretty far above where the chips can operate. If heatsinks are coming off because the solder is melting, I think you've got other problems ... that would probably require taking the heatsink off to fix anyway...