[CLOSED] BOUNTY: BFL SC die size (20BTC) and process node (20BTC)

[SgtSpike]

http://bitcoinmagazine.net/bfl-confirms-65nm-process-for-sc-lineup/

[eldentyrell]

The information is apparently in Bitcoin Magazine, and subscribers have reported getting the magazine already. A quick readthrough and post is worth 40BTC.

No, because the bounty clearly states (and has stated since the very first day it was posted) that it is null and void if BFL releases the figures.  BFL has released the process node, which is 65nm, so that bounty is no longer valid.

The die size bounty is still open.

[SgtSpike]

The information is apparently in Bitcoin Magazine, and subscribers have reported getting the magazine already. A quick readthrough and post is worth 40BTC.

No, because the bounty clearly states (and has stated since the very first day it was posted) that it is null and void if BFL releases the figures.  BFL has released the process node, which is 65nm, so that bounty is no longer valid.

The die size bounty is still open.

Didn't Josh say 3cm x 3cm, or was that external chip size, not die size?

[eldentyrell]

Didn't Josh say 3cm x 3cm, or was that external chip size, not die size?

Link?

[MrTeal]

Didn't Josh say 3cm x 3cm, or was that external chip size, not die size?

Link?

I thought the package size was 11mmx11mm.

30x30 is huge.

[SgtSpike]

Yes, sorry, 11mm x 11mm.  My memory was thinking of something else.

https://bitcointalk.org/index.php?topic=119351.msg1311322#msg1311322

[MrTeal]

The die size is 7.5mm^2

[SgtSpike]

The die size is 7.5mm^2

Where's the source for that then?

[Phos]

Tell you guys what.  I can confirm process node and die size if I can get a chip.
I can get the die size with XRD and process node with cross section SEM.
Anything thing else?  # of Metals, bonding wire method, packaging durability,
well profile, die thickness

[LiteBit]

The die size is 7.5mm^2

Where's the source for that then?

Check the comments section.  BFL_Josh clears up the die size question. 
https://forums.butterflylabs.com/content.php/125-BFL-ASIC-Update

The die size is 7.5mm^2

[eldentyrell]

Check the comments section.  BFL_Josh clears up the die size question.  
https://forums.butterflylabs.com/content.php/125-BFL-ASIC-Update

The die size is 7.5mm^2

Hrm, that would be a square die less than 3mm on each side, which is pretty hard to wirebond and in a package that would be ridiculously oversized for it.  There are sometimes power and thermal reasons for using an absurdly large package, but putting a 7.5(mm^2) die in an 11mmx11mm package means you're going to have bonding wires on the order of 4mm long on all sides -- at that point you have some serious inductance in the bond wires.  Not saying it's impossible, but it certainly is unusual.  That's the very upper limit of what MOSIS allows.

Can we get BFL_Josh to confirm that he didn't mean (7.5mm)^2 aka 56.25(mm^2)?  He's transposed those two units before claiming the package was 11mm^2.

7.5(mm^2) isn't impossible, but 56.25(mm^2) is more plausible.

[scrybe]

Check the comments section.  BFL_Josh clears up the die size question.  
https://forums.butterflylabs.com/content.php/125-BFL-ASIC-Update

The die size is 7.5mm^2

Hrm, that would be a square die less than 3mm on each side, which is pretty hard to wirebond and in a package that would be ridiculously oversized for it.  OTOH there are sometimes power and thermal reasons for using an absurdly large package.

Can we get BFL_Josh to confirm that he didn't mean (7.5mm)^2 aka 56.25(mm^2)?  He's transposed those two units before claiming the package was 11mm^2.

7.5(mm^2) isn't impossible, but 56.25(mm^2) is more plausible.

He confirmed it on the BFL thread referenced earlier. 56.25mm². 7.5x7.5mm.

[eldentyrell]

He confirmed it on the BFL thread referenced earlier. 56.25mm². 7.5x7.5mm.

Thank you, that makes way more sense.  Somebody please teach that man the difference between mm and mm².