From what I read, I thought the chips were fine, and it was their PCB that needs to be redesigned and fixed. Supposedly a new one has already been designed and completed, but I doubt that much. However, they should be doinmore tests over the next week or 2, and should hopefully fix a few things. Till then, MOAR FPGAs!
Even if the ASICs would work in a 24/7 setup, a PCB which is able to handle that kind of thermal power is not trivial. I think with the currently demonstrated power consumption the silicon is not stable in a 24/7 setup.
They could throw away the PCB, the cases and the heat sinks and create a completely new product with those ASICs at a much lower clock. If you look back what it took them to create the simple PCB and the boxes, I would not expect a product in the next few months in this case.
