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Author Topic: ACTUAL Butterfly Labs PCB pics!  (Read 40266 times)
Keefe
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October 31, 2012, 07:15:41 AM
 #121

Aha! Now we know why chip production is behind schedule. You bought your chip designer on craigslist!  Grin Tongue

I'm just joking and mean no offence to Nasser!

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November 01, 2012, 05:37:02 PM
 #122

If the boards are already made, and asics already placed, something like this would probably be enough:




What'd be ideal is if these were almost exactly the same height as the space between bottom of board to enclosure, so that if the thermal adhesive proves not to be reliable, at least the heatsinks will be kept in place (not a bunch of copper pieces shaking around and contacting the board).

Would it be possible to solder something like this to the board before the ASIC chips are placed?

Where do you buy these kind of heatsinks and what are they called?  I have a feeling I'm going to need some.
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November 01, 2012, 05:49:14 PM
 #123

If the boards are already made, and asics already placed, something like this would probably be enough:


What'd be ideal is if these were almost exactly the same height as the space between bottom of board to enclosure, so that if the thermal adhesive proves not to be reliable, at least the heatsinks will be kept in place (not a bunch of copper pieces shaking around and contacting the board).

Would it be possible to solder something like this to the board before the ASIC chips are placed?

Where do you buy these kind of heatsinks and what are they called?  I have a feeling I'm going to need some.

http://www.newegg.ca/Product/Product.aspx?Item=N82E16835708009
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November 01, 2012, 05:56:16 PM
 #124

If the boards are already made, and asics already placed, something like this would probably be enough:


What'd be ideal is if these were almost exactly the same height as the space between bottom of board to enclosure, so that if the thermal adhesive proves not to be reliable, at least the heatsinks will be kept in place (not a bunch of copper pieces shaking around and contacting the board).

Would it be possible to solder something like this to the board before the ASIC chips are placed?

Where do you buy these kind of heatsinks and what are they called?  I have a feeling I'm going to need some.

http://www.newegg.ca/Product/Product.aspx?Item=N82E16835708009

We just need to find out the dimensions of the package BFL is using for their ASIC...
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November 01, 2012, 06:21:11 PM
 #125

If the boards are already made, and asics already placed, something like this would probably be enough:


What'd be ideal is if these were almost exactly the same height as the space between bottom of board to enclosure, so that if the thermal adhesive proves not to be reliable, at least the heatsinks will be kept in place (not a bunch of copper pieces shaking around and contacting the board).

Would it be possible to solder something like this to the board before the ASIC chips are placed?

Where do you buy these kind of heatsinks and what are they called?  I have a feeling I'm going to need some.

http://www.newegg.ca/Product/Product.aspx?Item=N82E16835708009

We just need to find out the dimensions of the package BFL is using for their ASIC...

Just measure them. You know the board is 92mmx92mm, count pixels.
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November 01, 2012, 06:22:36 PM
 #126

11mm^2

If you're searching these lines for a point, you've probably missed it.  There was never anything there in the first place.
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November 01, 2012, 06:24:18 PM
 #127

11mm^2

didn't take long for Inaba to count the pixels  Tongue
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November 01, 2012, 06:24:48 PM
 #128

11mm^2

Is that the die size? Or is the package 11x11?
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November 01, 2012, 06:25:21 PM
 #129

Package size.  Do I get half a bounty?

If you're searching these lines for a point, you've probably missed it.  There was never anything there in the first place.
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November 01, 2012, 06:28:50 PM
 #130

I wish BFL had used ceramic packaging instead of plastic. How much more can mil-spec ASIC's cost?  Wink
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November 01, 2012, 06:29:00 PM
 #131

Package size.  Do I get half a bounty?

Just out of curiosity, suppose we get our boards and you guys upgrade your chips a year later.  Would it be possible to just do chip swaps?  Pop off the old one and insert the new, smaller, faster one?
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November 01, 2012, 06:47:48 PM
 #132

Package size.  Do I get half a bounty?

Just out of curiosity, suppose we get our boards and you guys upgrade your chips a year later.  Would it be possible to just do chip swaps?  Pop off the old one and insert the new, smaller, faster one?

If this were intended, the chips would be socketed.

"All safe deposit boxes in banks or financial institutions have been sealed... and may only be opened in the presence of an agent of the I.R.S." - President F.D. Roosevelt, 1933
bce
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November 01, 2012, 07:29:29 PM
 #133

Package size.  Do I get half a bounty?

Just out of curiosity, suppose we get our boards and you guys upgrade your chips a year later.  Would it be possible to just do chip swaps?  Pop off the old one and insert the new, smaller, faster one?

If this were intended, the chips would be socketed.

Yeah, and with a nice slab of copper in the middle of the socket  Grin

I'm still trying to imagine how to cool the bottom side of these chips.  If there are no traces directly under the ASIC chip, I'd like to cut a square hole under each chip and get at least some copper down there... The hole size would be limited by pressure on the ASIC being applied from the HSF on the top side.   The bottom heatsink could simply be a small square about the height of the board's depth above a larger square that adheres flush with board, and with some fins beneath.  It'd be like a 2 level pyramid with fins on bottom.

This is just my best guess for how I'd modify things on the board if I could magically change the existing design.


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beekeeper
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November 01, 2012, 07:44:34 PM
 #134

Package size.  Do I get half a bounty?

Just out of curiosity, suppose we get our boards and you guys upgrade your chips a year later.  Would it be possible to just do chip swaps?  Pop off the old one and insert the new, smaller, faster one?

If this were intended, the chips would be socketed.

Yeah, and with a nice slab of copper in the middle of the socket  Grin

I'm still trying to imagine how to cool the bottom side of these chips.  If there are no traces directly under the ASIC chip, I'd like to cut a square hole under each chip and get at least some copper down there... The hole size would be limited by pressure on the ASIC being applied from the HSF on the top side.   The bottom heatsink could simply be a small square about the height of the board's depth above a larger square that adheres flush with board, and with some fins beneath.  It'd be like a 2 level pyramid with fins on bottom.

This is just my best guess for how I'd modify things on the board if I could magically change the existing design.

Copper island and vias can transfer as much as 30% of heat from the chip on the other side of the PCB. Just add heatsinks on the other side.

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scrybe
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November 01, 2012, 07:54:58 PM
 #135

11mm^2

Is that the die size? Or is the package 11x11?

That is NOT an area of 11mm^2 (3.1x3.1mm), it must be 11x11mm.

Area on these bad boys (package, not die) is 121mm^2 if they are 11x11.

"...as simple as possible, but no simpler" -AE
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MeSarah
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November 01, 2012, 08:07:18 PM
 #136

@ bce

I would think that if you start cutting on the circuit board you will void the warranty.

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November 01, 2012, 08:13:45 PM
 #137

11mm^2

didn't take long for Inaba to count the pixels  Tongue

I counted pixels and arrived at the same conclusion:

I don't see a die-size prediction. I'm going with 24mm^2

From the board pictures, the chip packages appear to my eyes to be 11x11mm.

Not that that says a whole lot about the die size.

"All safe deposit boxes in banks or financial institutions have been sealed... and may only be opened in the presence of an agent of the I.R.S." - President F.D. Roosevelt, 1933
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November 01, 2012, 08:36:13 PM
 #138

@ bce

I would think that if you start cutting on the circuit board you will void the warranty.


"All safe deposit boxes in banks or financial institutions have been sealed... and may only be opened in the presence of an agent of the I.R.S." - President F.D. Roosevelt, 1933
abeaulieu
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November 01, 2012, 09:03:22 PM
 #139

11mm^2

Is that the die size? Or is the package 11x11?

That is NOT an area of 11mm^2 (3.1x3.1mm), it must be 11x11mm.

Area on these bad boys (package, not die) is 121mm^2 if they are 11x11.

Like Inaba said: (11mm)^2
lol
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November 02, 2012, 03:35:09 AM
 #140

11mm^2

Is that the die size? Or is the package 11x11?

That is NOT an area of 11mm^2 (3.1x3.1mm), it must be 11x11mm.

Area on these bad boys (package, not die) is 121mm^2 if they are 11x11.

Like Inaba said: (11mm)^2
lol

I'm just curious as to why the sub script isn't used: 112
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