Nice, got it.

Can anyone give an estimate of the wattage through the various chips, the avalon, the ir3895s, etc.?

Why would these KiCAD files just give errors when trying to open?

I am close to having any kind of model you want whether water-cooled, fan, heat-sink only, etc. but I cannot get Kicad to load the K16 cad. I need info on the dimensions and specifics of the parts and board (i.e., materials). If I can get this board modeled I will be able to run predictions on many different designs within minutes. I can change fin sizes and all sorts of stuff.

Die pad thickness and area?

Edit: Nevermind about the die pad - I got it.

Can't login to Bitfunder. What is up with that?

I have Tor running and connected on 12.0.0.7:9051 and I have adjusted the network settings for BTC-Qt to connect through SOCKS proxy at 12.0.0.7:9051 trying both v4 and v5 but it will not establish a connection to the BTC network. What could I be doing wrong?

They said they were going to inform us on what batch of chips our purchase would be fulfilled by, thus giving us an estimate on how long after the first units ship that we would receive our units. That was supposed to come last Friday, then they changed it to Monday, and here it is almost a week later from the initial date and still no word.

I have some questions before I can accurately model the board:

1) What is the thickness of the silicon?
2) What is on the under-side of the board?
3) How are TerraHash, yourself and others expecting to transfer heat from the components, through the silicon, to the aluminum heat sinks? Thermal pads, paste?
4) What material covers the avalon chips and why can't heatsinks be attached directly to them?
5) This is only a single layer board with no trace or components on the under-side or internal layers?

Thanks.


Cool.

What file type are the electronic copies of the K16 in? Are they CAD files or Eagle PCB files? I suppose they are on Github but what program do I need to open them?

Paid to their Paypal account - however, they can't get the money you sent them.

I get screwed if they refund the order. Can we contact Paypal and bitch at them?

I think they are out in San Diego living it up on our money - Cristal, Mojitos, and high-dollar hookers.

Yes, you want turbulent flow for mixing near the wall. You want Reynolds number to be above 4000, at least close. But assuming all variables are held constant, larger pipe diameters produce larger Reynolds numbers. Re = (rho*V*Dh)/mu. However, if your larger pipe diameter reduces velocity then you will not see a Re increase.

I just sent an email, as if that will help.

We were told we would hear something Friday as to our orders so we could decide whether to cancel. Then we were told "Monday" and we still don't have anything. I would like to know what the deal is. Perhaps they don't want to say that the first 3 chip orders aren't enough to fulfill the majority of the board orders. 

So the water is running through the inside of the "box"? The largest problem with any setup like this is making sure that there is conduction between the chips and aluminum to the water. There will be no convective cooling in this setup (such as blowing air over the chip without any heat-sink). I also wouldn't consider setting something like this up along with a radiator and fan as "easy" unless you already have this stuff around. But I would have to see a design to make sure I understand what you are talking about.

Edit: OK, I've seen a design similar to what you are talking about. So, these current designs are placing heatsinks/aluminum housing on the underside of the board... how is heat being conducted from the thermal pad on the chip, through the board, and to the heatsink/aluminum? If it is just silicon then there may be a conduction/heat-transfer issue. It seems that this QFN design isn't really made for external heat dissipation.

I don't see that BFL and Avalon have any continued advantage to delay in order to hold off difficulty because ASICMiner will supposedly be releasing their next generation chips before the end of the year. Once they do this, current gen BFL and Avalon chips will be obsolete. They may as well just get them out the door while they still can.

Another thing I was thinking which may be a bit off topic is in regards to BFL, especially. That is they are having these chips made in China... that basically amounts to an ASIC technology transfer to China. Who doesn't believe that the Chinese are producing their own chips for use directly based off these various ASIC chips? I am almost willing to be they have an assembly line producing BFL chips for themselves right beside the one that go to BFL customers. With this kind of application you are pretty much stabbing yourself in the stomach by having your chips made there because of the concept of "difficulty" and not necessarily just a simple technology transfer.

But I thought that that discussion is saying that they are going to change the board so that it is necessarily overclocked and in order to put 16 chips will require an extra power reg. I may be mistaken.

I need to know how cool. I need estimates of heat generation of the chips (at least) and possibly the other components on the board. Fan or no fan? Stock components or custom (for the heat sink)? etc.

I am an engineer with a background in aerodynamics/fluids and am capable of performing Heat/CFD simulations. Is there any way I can contribute to the heat sink/dissipation design. I can't promise anything but I can try if I had more understanding of what the goals/design are.