That is initially. But one day even small amounts of hashing power may bring in an extra $1000 per year.

So, I need to mine XPM for a few days with my 1200 PPS to find a block?

What is unfair about it? How can someone who doesn't understand free markets even be a proponent of cryptocurrencies? Are you sure you are in the right place? ASICs will bring mining to more people than GPUs and CPUs ever did.

ASICs are a benefit to cryptocoins, the last thing you want to do is make a coin that prevents ASIC use. There will be ASICs that can mine XPM, if XPM continues to be a success.

-1 and 4 are not good settings - I'm leaving it at 24. I guess that means 6 threads per core.

There are probably some miners who have GPUs working they just haven't told anyone else how to do it.

Setting it to -1 gives only 240 pps.

It may use all the cores but not enough threads or something.

If I have a core i5-2500k - that is four cores, what should I be putting my setgenerate to? I have set it everywhere from -1 to 16 and I am currently at 1250 primespersec. Is primespersec the best way to determine effectiveness?

The symbol should be a phenix with silver feathers flying around the globe like firefox icon.

I always thought that TH was waiting on BKK - so never imagined that they could get anything running prior to that. Thing is... is BKK making the overclocked board or not?

Terrahash

I think the paypal refunds issue is due to the freeze on their account, is it not?

Also, is Terrahash doing their own rework of the initial K16 separate from BBKcoins? I think they are waiting for him to finish the boards, correct?

I didn't account for serrations but I think I can apply a surface area multiplier - this will improve heat-sink performance. The two raise channels will probably have little effect on the final result. The current assumption is that there is "perfect" contact between the sink and the board. I think I can add a compound on the interface but have not done so yet.

I will adjust the thickness of the base in the next run. As far as the thermal vias, I am still working on tweaking this. I currently am using copper lands which extend from the pad of the Avalon to the heat sink. Modeling is always a trade-off, it is important to get things as close as possible but sometimes too much detail is not worth the effort. These PCB/heat models can be very accurate (90-99%) so long as the main features are present and the mesh resolution is good enough.

As interesting as producing my own heatsinks would be, I currently have no immediate plans to sell heatsinks, but who knows how things will work out in the future. This was a rough model of a commercially available heatsink posted on another forum by Bicknellski.

Yes, heat-transfer is a game of surface-area. This is why insulating a pipe too much can actually have the opposite effect.

I have since run another model which is based directly from "Heat sink #4" posted by Bicknellski. The initial design above was based on it but I did not have the length of the fins correct. This model changes the overall height from 10mm to 32 mm. There is no airflow, just standing air with the heat-sink portion facing "up" so that the heat can rise away from the board and not get trapped. I accidentally took the picture rotated incorrectly, so please take that into account. The heat is rising not falling. Extending the fins has drastically improved the temperature, reducing it from 150C to 78C.


Heatsink #4 - Length 100.00 mm, Width 97.00 mm, Height 32.00 mm, Thickness taken to be 2mm.


Extending the fins by about 20 mm has reduced the temperature to 78C, approximately a 50% reduction in temperature. (Note: picture was taken upside down - I will update).

I will look at this. I have changed the size of the heatsink to one which was discussed in the Klondike DIY thread and the temps are down to 78C without any air movement. I will post on the heat-sink thread.

This is my first attempt at a simplified model of the K16 I've made using only the Avalon chips. I have them generating 2W each. They are modeled as QFN chips with most of the details and majority of the dimensions correct. I have modeled the lands that go through the board but they may not be meshing correctly so I will continue to look at that. I can add other chips and more detail if I can get the measurements and power output. The more exact I make the model, the more realistic the results will be.

This model uses an aluminum heat-sink which covers the entire bottom surface, the fins and base are 2mm thick - it is based off the heat-sink posted about 20 pages ago. I can alter this to any type of design: change fin size and number, change to fingers, etc. Additionally, this model is cooling only from the heat-sink, i.e., there are no fans or any air movement except that from buoyant convection. It is actually a transient scenario but here I am only using a steady-state model, but I can look at transient.

The temps seem a little high to me, 148 C (300 F), but of course this is without any air movement. However, many GPUs can get to 120 C or more if heat-sinks aren't attached or no air. This was just a first shot and I am going try some other things and recheck this solution, etc.


Avalon chips wire-frame.


Simplified board model with heat-sink.


Heat-transfer analysis showing temps of chips with no forced convective flow air exchange. Temps of chips reach approx. 150 C while operating at 2W with this heat-sink.

The thermal vias are accounted for through the "lands" that go through the PCB. They are outlined in red in that first pic on the underside of the chips.

I can model water-blocks, heat-exchangers, all kinds of stuff, fans, etc. all in one model.

I am aware you are trying to keep this thread to the electronics and testing, but just wanted to give you guys a heads-up on a simplified model of the K16 I've made using only the Avalon chips. I have them generating 2W each. They are modeled as QFN chips with most of the details and majority of the dimensions correct. I have modeled the lands that go through the board but they may not be meshing correctly so I will continue to look at that. I can add other chips and more detail if I can get the measurements and power output. The more exact I make the model, the more realistic the results will be.

This model uses an aluminum heat-sink which covers the entire bottom surface, the fins and base are 2mm thick - it is based off the heat-sink posted about 20 pages ago. I can alter this to any type of design: change fin size and number, change to fingers, etc. Additionally, this model is cooling only from the heat-sink, i.e., there are no fans or any air movement except that from buoyant convection. It is actually a transient scenario but here I am only using a steady-state model, but I can look at transient.

The temps seem a little high to me, 148 C (300 F), but of course this is without any air movement. However, many GPUs can get to 120 C or more if heat-sinks aren't attached or no air. This was just a first shot and I am going try some other things and recheck this solution, etc.


Avalon chips wire-frame.


Simplified board model with heat-sink.


Heat-transfer analysis showing temps of chips with no forced convective flow air exchange. Temps of chips reach approx. 150 C while operating at 2W with this heat-sink.

I am aware you are trying to keep this thread to the electronics and testing, but just wanted to give you guys a heads-up on a simplified model of the K16 I've made using only the Avalon chips. I have them generating 2W each. They are modeled as QFN chips with most of the details and majority of the dimensions correct. I have modeled the lands that go through the board but they may not be meshing correctly so I will continue to look at that. I can add other chips and more detail if I can get the measurements and power output. The more exact I make the model, the more realistic the results will be.

This model uses an aluminum heat-sink which covers the entire bottom surface, the fins and base are 2mm thick - it is based off the heat-sink posted about 20 pages ago. I can alter this to any type of design: change fin size and number, change to fingers, etc. Additionally, this model is cooling only from the heat-sink, i.e., there are no fans or any air movement except that from buoyant convection. It is actually a transient scenario but here I am only using a steady-state model, but I can look at transient.

The temps seem a little high to me, 148 C (300 F), but of course this is without any air movement. However, many GPUs can get to 120 C or more if heat-sinks aren't attached or no air. This was just a first shot and I am going try some other things and recheck this solution, etc.


Avalon chips wire-frame.


Simplified board model with heat-sink.


Heat-transfer analysis showing temps of chips with no forced convective flow air exchange. Temps of chips reach approx. 150 C while operating at 2W with this heat-sink.

Yes, they have nothing to say.