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Author Topic: ASICMINER: Entering the Future of ASIC Mining by Inventing It  (Read 3916338 times)
tinyfox266
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April 20, 2014, 05:05:30 AM
 #18681

no dividends for a couple of weeks. Is there anything wrong?
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Every time a block is mined, a certain amount of BTC (called the subsidy) is created out of thin air and given to the miner. The subsidy halves every four years and will reach 0 in about 130 years.
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April 20, 2014, 05:26:52 AM
 #18682

no dividends for a couple of weeks. Is there anything wrong?

Nothing wrong just kind of quiet waiting for gen 3 and the current miners not finding that many blocks

Believing in Bitcoins and it's ability to change the world
tinyfox266
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April 20, 2014, 06:01:50 AM
 #18683

no dividends for a couple of weeks. Is there anything wrong?

Nothing wrong just kind of quiet waiting for gen 3 and the current miners not finding that many blocks

have fried cat ever revealed some info about  the current status of the company or gen 3?  When it can distribute the dividends again?
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April 20, 2014, 06:21:11 AM
 #18684

no dividends for a couple of weeks. Is there anything wrong?

Nothing wrong just kind of quiet waiting for gen 3 and the current miners not finding that many blocks

have fried cat ever revealed some info about  the current status of the company or gen 3?  When it can distribute the dividends again?

all the info is in this thread. just read the last 5-10 pages and you will know what is going on, its not that hard.
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April 20, 2014, 06:35:57 AM
 #18685

no dividends for a couple of weeks. Is there anything wrong?

Nothing wrong just kind of quiet waiting for gen 3 and the current miners not finding that many blocks

have fried cat ever revealed some info about  the current status of the company or gen 3?  When it can distribute the dividends again?

all the info is in this thread. just read the last 5-10 pages and you will know what is going on, its not that hard.

That too guess you can stalk Friedcat says if you want as well although it doesn't mention any Rockxie related stuff
https://twitter.com/FriedcatSays

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April 21, 2014, 03:25:06 AM
 #18686

Friedcat has spoken:

Update

The documents as well as the (verified & produced) sample design are out:

Schematics - https://mega.co.nz/#!uNMkFZoI!lnlRehlynQQzNRfQ87_UYek1RtrOUvLZ6a074XeRqlo

Reference PCB File - https://mega.co.nz/#!DZVHgS6D!6pmTsmrito8rfVJJ-etvznOtUcalbAT6vU-C8EqY0_I

datasheet - https://docs.google.com/document/d/1_dmXzyMqtr7tVZukk2DAJih2sRq5jDy5DQPkwCce570/edit?usp=sharing

bonding list - https://docs.google.com/spreadsheet/ccc?key=0Al1fvFT7Sd5bdFFZSUllNW5seVRfM01kcDVqZkJfdFE&usp=sharing

9x9 package pictures -
https://drive.google.com/file/d/0B11fvFT7Sd5bUV90cFN4cEhTNEk/edit?usp=sharing
https://drive.google.com/file/d/0B11fvFT7Sd5banZkMDZqSTBGTEE/edit?usp=sharing
https://drive.google.com/file/d/0B11fvFT7Sd5bWjh6MmJsMFpCYkU/edit?usp=sharing

8x8 package picture -
https://mega.co.nz/#!DA1mBJzB!7hFnoT8ZYQd1d30m2oHbuscD36cCQ4ou7stsr5Lo03Y

The package we are using is 9mmx9mm, but it might be partly switched to 8mmx8mm.
Also, we plan to increase the center pad size to at least 7mmx7mm, so please leave enough margin on the PCB to avoid unnecessary re-designs.
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April 21, 2014, 03:27:51 AM
 #18687

We need to dissect any possible differences to prior information. Friedcat, what's the consumption, price and availability date?

I should have gotten into Bitcoin back in 1992...
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April 21, 2014, 03:58:31 AM
 #18688

Friedcat, what's the consumption, price and availability date?

I believe the power consumption will somewhat depend on the PCB implementation and the DC to DC power circuit on the board. I expect there will be boards with slightly varying power consumption.

The only thing we know today is preliminary numbers from Rockxie who did some test boards, but he had some (unrelated to BE200) component troubles. He did not post his final results yet as far as I know.

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April 21, 2014, 03:59:48 AM
 #18689

MOOOON
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April 21, 2014, 07:09:45 AM
 #18690

Not sure if I recall someone discussing this already or not, but what is your opinion on the Samsung GlobalFoundaries partnership and will it have any impact on future chip releases from Asicminer? Not a wafer person so hopefully not just asking a weird question.

http://www.theregister.co.uk/2014/04/17/samsung_globalfoundries_ink_exclusive_multiyear_14nm_finfet_deal/
http://online.wsj.com/news/articles/SB10001424052702304626304579508052587689582?mg=reno64-wsj&url=http%3A%2F%2Fonline.wsj.com%2Farticle%2FSB10001424052702304626304579508052587689582.html

Samsung and GlobalFoundries have announced a collaborative agreement that will enable 14-nanometer FinFET chippery to be manufactured at Samsung's fabs in Hwaseong, South Korea and Austin, Texas, as well as at GlobalFoundries' fab in Saratoga, New York.

"This is a paradigm change to the foundry landscape," GlobalFoundries VP of product management Ana Hunter said in an announcement video.

http://vimeo.com/92152458


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antirack
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April 21, 2014, 09:30:08 AM
 #18691

Not sure if I recall someone discussing this already or not, but what is your opinion on the Samsung GlobalFoundaries partnership and will it have any impact on future chip releases from Asicminer? Not a wafer person so hopefully not just asking a weird question.

http://www.theregister.co.uk/2014/04/17/samsung_globalfoundries_ink_exclusive_multiyear_14nm_finfet_deal/
http://online.wsj.com/news/articles/SB10001424052702304626304579508052587689582?mg=reno64-wsj&url=http%3A%2F%2Fonline.wsj.com%2Farticle%2FSB10001424052702304626304579508052587689582.html

Samsung and GlobalFoundries have announced a collaborative agreement that will enable 14-nanometer FinFET chippery to be manufactured at Samsung's fabs in Hwaseong, South Korea and Austin, Texas, as well as at GlobalFoundries' fab in Saratoga, New York.

"This is a paradigm change to the foundry landscape," GlobalFoundries VP of product management Ana Hunter said in an announcement video.

http://vimeo.com/92152458



It doesn't matter, sooner or later ASICMiner will take over both of them.
(and then move on to make 3D mutli-stack 14nm Bitcoin ASICs)

Grin
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April 21, 2014, 10:21:48 AM
Last edit: April 21, 2014, 10:56:09 AM by rudi
 #18692

Also, we plan to increase the center pad size to at least 7mmx7mm,

Any ideas what this means? What does the center pad do, why and how will it be increased in size?
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April 21, 2014, 11:22:14 AM
 #18693

Also, we plan to increase the center pad size to at least 7mmx7mm,

Any ideas what this means? What does the center pad do, why and how will it be increased in size?

Improved heat transfer from chip to PCB.

Some info on the QFN package and board mounting of a QFN packaged chip.
http://www.atmel.com/images/doc8583.pdf
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April 21, 2014, 11:34:49 AM
 #18694

Also, we plan to increase the center pad size to at least 7mmx7mm,

Any ideas what this means? What does the center pad do, why and how will it be increased in size?

Improved heat transfer from chip to PCB.

Some info on the QFN package and board mounting of a QFN packaged chip.
http://www.atmel.com/images/doc8583.pdf

Does this mean that AM implicitly acknowledged that power consumption is greater than expected?
necro_nemesis
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April 21, 2014, 11:46:45 AM
 #18695

Increased thermal transfer and VSS conduction. Through the package selected. Assume the wafers performed favorably at high clock speeds and can be pushed. As everyone would like to see comprehensive test results including various modes of operation under differing cooling conditions.

Does this mean that AM implicitly acknowledged that power consumption is greater than expected?

I assume an EE could calculate how much capacity this area would relate to but it may be a function of heat dissipation.

The main takeaway is we're soldiering on which is an indication of the ASICs viability.
MichaelBliss
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April 21, 2014, 01:59:39 PM
 #18696

Also, we plan to increase the center pad size to at least 7mmx7mm,

Any ideas what this means? What does the center pad do, why and how will it be increased in size?

Improved heat transfer from chip to PCB.

Some info on the QFN package and board mounting of a QFN packaged chip.
http://www.atmel.com/images/doc8583.pdf

Does this mean that AM implicitly acknowledged that power consumption is greater than expected?

No, it means you are speculating and attempting to draw conclusions without enough information to go on.
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April 21, 2014, 10:03:57 PM
 #18697

Also, we plan to increase the center pad size to at least 7mmx7mm,

Any ideas what this means? What does the center pad do, why and how will it be increased in size?

Improved heat transfer from chip to PCB.

Some info on the QFN package and board mounting of a QFN packaged chip.
http://www.atmel.com/images/doc8583.pdf

Does this mean that AM implicitly acknowledged that power consumption is greater than expected?

No, that's not what it means.

The price difference at the packaging factory is probably marginal between the announced 7x7 or 8x8 mm or 9x9 mm (that's what they went for for now) QFN packages. But for board designers who have to worry about the thermal aspect, bigger is always better when it comes to heat sinks. And that's what the pad is, a heat sink that transfers the heat to the PCB.

It means AM is just trying to do a better job than their competition.

Grin
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April 21, 2014, 10:16:29 PM
 #18698

Also, we plan to increase the center pad size to at least 7mmx7mm,

Any ideas what this means? What does the center pad do, why and how will it be increased in size?

Improved heat transfer from chip to PCB.

Some info on the QFN package and board mounting of a QFN packaged chip.
http://www.atmel.com/images/doc8583.pdf

Does this mean that AM implicitly acknowledged that power consumption is greater than expected?

Yeah you're going to have to start mining by coal oil lantern to make up the difference.  Roll Eyes Who knows without data or information from a reliable source. I wouldn't sit there speculating with the amount of information available other than for curiosity sake.
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April 21, 2014, 10:25:34 PM
 #18699

This is to inform that friedcat met with the board today and provided some updates.

General Update
==============
Tapeout and initial testing of the Gen-3 chip was a success. The power draw is higher than expected - it remains to be seen by how much it can be reduced. Current developments focus on optimizing Gen-3 and working on Gen-4 which will be a lower nm tech. Gen-4 is overall a more challenging product, but friedcat and his team are confident that AM can compete both on price and power-efficiency with each generation of chips. AM will provide an open-source reference design for the PBC board for Gen-3 when sales are offered on a more casual basis. The packaging of the chip may change over time (point of optimization), so the board design needs to accommodate this.

The exact pricing is negotiated with large quantity buyers at the discretion of AM within the range advertised. The production rate will be high enough to sustain the empirically observed exponential growth of the hashing power within the near future. AM is trying to trade off risk with rewards as much as possible when allocating chips to self-mining, franchising and sales.

The dividend schedule will be aggressive, as AM will not require large sums of retained capital. The rationale is that AM doesn't need to invest large sums into infrastructure and that the majority of chip production costs will be covered by the business partners on a contract schedule. The new round of dividends are scheduled to begin as soon as the first large purchases have concluded and should precede or coincide with the publication of the updated financial statements.

Specific Updates
================

Submitted Questions:
1) What is the status, size, and expected delivery of the next batch of chips? What about the one after that?
re 1) This month: 850k, next month: 3.35m (order size), June: 6.7m (order size), assuming each chip is 10G.

2) What are the final specifications of the generation 3 chips? Initial tests of ROCKMINER showed an increased power consumption (http://blog.rockminer.com/#!/2014/04/13/Testing_Results_Of_BE200.md). What is the actual power consumption?
re 2) Worse than expected due to power distribution surprises. Actual power consumption 0.5w-0.7w within reasonable speed range (7G-11G)

3) When will the ordering terms for generation 3 chips be published? Has the pricing been adjusted in any way meanwhile? What about auctions like we had with generation 1 hardware?
re 3) Most orders come from sample chip requests first, then collaboration with our tech team for about 1 month. So till now the ordering are one-on-one. The price hasn't been adjusted yet. The auction works only after there are widely available proven reference designs for immediate mass production.

4) When are the new chips expected to start mining in ASICMiner datacenters and what hashrate are you currently planning on deploying?
re 4) May-June for air cooling and June-July for immersion cooling. They are only capable of 3PH. Most should go franchising or as chips for other vendors' OEM products.

5) When are the sales revenues of the chips expected to be paid out to shareholders?
re 5) When the balance payments are received and exchanged for Bitcoins.

6) What conditions/prices does ROCKMINER (as a big shareholder of ASICMiner) get for generation 3 chips?
re 6) Same as other large scale purchasers.

7) Is there an ongoing cooperation with Allied Control in terms of Datacenter development? How does ASICMiner/shareholders profit from it?
re 7) Their container project seems going well. Also there are third party designers planning to make boards solely for immersion cooling. So we don't have to spend much design efforts on it.

8 ) What current plans for generation 4(+) are there?
re 8 ) Gen4 is 28nm and our main focus is fixing the unexpected problems of this generation. The room of improvement is still large and the positive news is that even we have a lot of problems in this gen of chip we remain in the most power- and cost-effective class.

General Disclaimer
==================

Please note that some information is subject to change, as this is a very agile business. Please be careful when speculating on company valuation. This information is purely provided as a service to current shareholders and may not be free of errors.

The ASICMINER Project https://bitcointalk.org/index.php?topic=99497.0
"The way you solve things is by making it politically profitable for the wrong people to do the right thing.", Milton Friedman
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April 21, 2014, 10:31:38 PM
Last edit: April 21, 2014, 10:48:42 PM by Franktank
 #18700

Submitted Questions:
1) What is the status, size, and expected delivery of the next batch of chips? What about the one after that?
re 1) This month: 850k, next month: 3.35m (order size), June: 6.7m (order size), assuming each chip is 10G.

Huzzah! Winter is nearly over!

So its about 10.9 million chips @ 10 GH/s = 109 PH/s
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