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Author Topic: Swedish ASIC miner company kncminer.com  (Read 3045502 times)
jelin1984
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July 20, 2014, 02:53:09 PM
 #36881

You install the heatsink up to the plate or you removed the plate
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July 20, 2014, 03:10:45 PM
Last edit: July 20, 2014, 05:43:33 PM by user27
 #36882

You install the heatsink up to the plate or you removed the plate

As I said I can't claim that this is my handy work; but I think he removed the "E" shape plate yea.

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July 20, 2014, 07:45:40 PM
 #36883

You install the heatsink up to the plate or you removed the plate

As I said I can't claim that this is my handy work; but I think he removed the "E" shape plate yea.
What is the result in Gh/s gain?


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s1gs3gv
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July 20, 2014, 08:48:36 PM
 #36884

Yes any photos please

So demanding...


user27, if you want to make the image smaller you can add a width or height attribute in the opening image tag. For example, i've added a width=256 statement inside the opening image tag.



Could you please have a look and let me know what the part numbers printed on top of those two black 8 pin IC packages near the edge of the board and between the two cables in your photo are ?
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July 20, 2014, 08:57:01 PM
Last edit: July 20, 2014, 10:01:17 PM by user27
 #36885

user27, if you want to make the image smaller you can add a width or height attribute in the opening image tag. For example, i've added a width=256 statement inside the opening image tag.


Thanks, but I know really, was just messin'.

Could you please have a look and let me know what the part numbers printed on top of those two black 8 pin IC packages near the edge of the board and between the two cables in your photo are ?

Sorry, not my rig; it's all closed up now anyway as the cooling sucks without the box to direct the air flow/

What is the result in Gh/s gain?

It's more about cooling the VRM's properly so they don't burn out quite so quickly. However, with cooler ASIC temps he says his rig runs at about 3.5TH rather than 3.4TH (with one modified and four stock cubes). This could be down to reduced errors, I don't know/

If the same gain could be seen across the five cubes it could be upwards of 10% improvement. I should point out that this is based on a very subjective throw away comment and no proper testing.

u27

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July 20, 2014, 10:14:03 PM
 #36886

Could you please have a look and let me know what the part numbers printed on top of those two black 8 pin IC packages near the edge of the board and between the two cables in your photo are ?

One of them is an LM75, as I've told you a dozen times  Cheesy

Or do you still believe this?

Core temperature sensing is performed by circuits on the die.

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July 20, 2014, 10:34:38 PM
 #36887

Or do you still believe this?
Core temperature sensing is performed by circuits on the die.

Core temperature sensing is performed by circuits on the die; can't say it any clearer than that.

Likewise with the VRM temps; there is a circuit built in.

If it is an LM75A then it is "a temperature-to-digital converter using an on-chip band gap temperature sensor" i.e. "Core temperature sensing is performed by circuits on the die".

u27

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July 20, 2014, 10:42:50 PM
 #36888

Or do you still believe this?
Core temperature sensing is performed by circuits on the die.

Core temperature sensing is performed by circuits on the die; can't say it any clearer than that.

Likewise with the VRM temps; there is a circuit built in.

If it is an LM75A then it is "a temperature-to-digital converter using an on-chip band gap temperature sensor" i.e. "Core temperature sensing is performed by circuits on the die".

u27

"performed by circuits on the die" and "performed by a component on the board" are a bit different, no?

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July 20, 2014, 10:45:24 PM
 #36889

"performed by circuits on the die" and "performed by a component on the board" are a bit different, no?

Yes, they are very different, and in this instance temperature sensing is "performed by circuits on the die".

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July 20, 2014, 10:47:08 PM
 #36890

"performed by circuits on the die" and "performed by a component on the board" are a bit different, no?

Yes, they are very different, and in this instance temperature sensing is "performed by circuits on the die".
So you are saying the "Temperature" column here is coming from a circuit on the die, not an LM75 component on the board?


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July 20, 2014, 10:53:15 PM
 #36891

So you are saying the "Temperature" column here is coming from a circuit on the die, not an LM75 component on the board?

It is not either an LM75 ic OR a circuit on the die because it is BOTH of those things. The LM75A (if that's what's installed) is "a temperature-to-digital converter using an on-chip band gap temperature sensor"; all it does is convert "temperature-to-digital" such that it can be presented as illustrated above.

How exactly do you think the LM75 would sense the temperature of the chip if it were not connected to a circuit on the die?

u27

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July 20, 2014, 10:55:42 PM
 #36892

So you are saying the "Temperature" column here is coming from a circuit on the die, not an LM75 component on the board?

It is not either an LM75 or a circuit on the die because it is both of those things. The LM75A (if that's what's installed) is "a temperature-to-digital converter using an on-chip band gap temperature sensor"; all it does is convert "temperature-to-digital" such that it can be presented as illustrated above.

How exactly do you think the LM75 would sense the temperature of the chip if it were not connected to a circuit on the die?

u27
If you are just going to play semantics of meaning, whatever.

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July 20, 2014, 11:22:01 PM
 #36893


Could you please have a look and let me know what the part numbers printed on top of those two black 8 pin IC packages near the edge of the board and between the two cables in your photo are ?

Please forgive me for just answering the fucking question that was asked.

One is an 
LM75
(closer to PCIe)

other is
24C32WP
k348k

It's the i2c EEprom

YMMV
Smiley


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July 20, 2014, 11:29:14 PM
 #36894


Could you please have a look and let me know what the part numbers printed on top of those two black 8 pin IC packages near the edge of the board and between the two cables in your photo are ?

Please forgive me for just answering the fucking question that was asked.

One is an 
LM75
(closer to PCIe)

other is
24C32WP
k348k

It's the i2c EEprom

YMMV
Smiley



Thanks tolip.

And maybe you could give your opinion on the statement "Core temperature sensing is performed by circuits on the die"

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July 20, 2014, 11:51:09 PM
 #36895

Thanks tolip.

And maybe you could give your opinion on the statement "Core temperature sensing is performed by circuits on the die"

The LM75 measures it own case temperature.
There _IS_ a die in there though.

The original statement may have originated by someone who was wordlexic.
Die(s)/PCB/cube whatever.

I don't rely on that temp for much of anything.
I ALWAYS use the hottest temp I can find for cooling decisions.

As I type...
67C on bottom of PCB directly below ASIC
61C reported by LM75

I IR gunned the PCB temp.
I could probbably find hotter but bottom of PCB's is inside my pentagon with trapped V8 bottle.
It's tight in there and the bottle is not a cooperative captive.
http://i.imgur.com/9T8lRc2.jpg
Wink

YMMV
Smiley

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July 21, 2014, 12:04:00 AM
 #36896

So you are saying the "Temperature" column here is coming from a circuit on the die, not an LM75 component on the board?

It is not either an LM75 ic OR a circuit on the die because it is BOTH of those things. The LM75A (if that's what's installed) is "a temperature-to-digital converter using an on-chip band gap temperature sensor"

"On-chip" in this sense generally implies the sensor is included in the IC package, not that it's reading an external sensor (read: on the SHA256 ASIC Die).

Further, the datasheet doesn't show any inputs for an external sensor.  Thus, it is likely that it is reading the PCB/ambient around the place where it's mounted, not the ASIC chips core temperature.
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July 21, 2014, 12:38:03 AM
Last edit: July 21, 2014, 12:58:20 AM by The Avenger
 #36897

There is nothing "on the die" sensing temperature.

There is an LM75 component (not on the die, but on the board aka PCB) that senses temperature.

Everything else is semantics.

As there is nothing "on the die" sensing temperature, the data from the LM75 is the only information available to give an indication of the asic core temperature. It's obviously not the actual real core temperature, as tolip's IR gun figures show, but the data on the status/advanced page is coming from the LM75 and not from any other source. Which is what I have been saying.

If you need any proof of this - carefully - put your finger on the LM75 and watch the temperature value on the web interface change.

For people who don't know what a die is, here are some educational links
http://diephotos.blogspot.co.uk/
http://en.wikipedia.org/wiki/Integrated_circuit_packaging
http://electronics.stackexchange.com/questions/56649/what-is-a-die-package (see the second answer, which starts "A DIE is the actual silicon chip (IC) that would normally be inside a package/chip.")

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July 21, 2014, 01:05:27 AM
Last edit: July 21, 2014, 01:23:36 AM by user27
 #36898

...the data on the status/advanced page is coming from the LM75 and not from any other source. Which is what I have been saying.

That is indeed what you keep saying and you are still wrong

Scratch that, yea, the basic LM75 does have the band gap sensor on-board. I was looking at the A version as I said in my post.

How about a schematic?

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July 21, 2014, 03:47:53 AM
Last edit: July 21, 2014, 04:08:03 AM by Phoenix1969
 #36899

...the data on the status/advanced page is coming from the LM75 and not from any other source. Which is what I have been saying.

That is indeed what you keep saying and you are still wrong

Scratch that, yea, the basic LM75 does have the band gap sensor on-board. I was looking at the A version as I said in my post.

How about a schematic?

Nearly the same setup in automotive systems...  analog potentiometers(sensors) connected to a small chip(like LM775) dedicated to converting those analog signals into something readable(digital) by the main computer. (Beaglebone or ECU) The reading hits a preset limit, and thermal automatic shutdown initiates(interrupt line) to save the engine or in our case asics/vrm's. A simple "if/then/else" type processor(conditional) triggers the interrupt(linear actuator) when the preset limit is reached.
http://www.maximintegrated.com/en/products/analog/sensors-and-sensor-interface/LM75.html
the automotive version:
http://www.ti.com/lit/ds/symlink/lm75b.pdf      Exactly the same unit with a few changes

inputs:  1. power
             2. analog sensor signals
output: 1. Digital conversions of the readings taken
             2. cutoff signal to linear actuator (or may be built in)
               


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July 21, 2014, 04:57:46 AM
 #36900


inputs:  1. power
             2. analog sensor signals
output: 1. Digital conversions of the readings taken
             2. cutoff signal to linear actuator (or may be built in)
               


There is no such analog sensor input on any of the lm75 revisions posted in the last couple of pages.
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